Package Printing News

GMG at the Fogra Multicolor Forum: Smart tools and new opportunities

The second Fogra Multicolor Forum took place in 2019. Seven solution providers were given color management challenges and invited to present their results and solutions, demonstrating their latest technologies.

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Hunkeler Innovationdays: Postponement by one year to 2022

The Hunkeler Innovationdays planned for 22-25 February 2021 will be postponed by one year to 21-24 February 2022. The reason for this is the postponement of the trade fair events due to the spread of the coronavirus. Since Drupa Düsseldorf is now postponed to April 2021, an adjustment of the industry meeting in Lucerne is the logical consequence. This decision was made in close cooperation with various printer and finishing exhibition partners.

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How to avoid the finishing bottleneck

At Labelexpo Europe 2019, Domino Digital Printing Solutions gave everyone a sneak preview of its next generation digital embellishment technology prior to its official launch in April 2020. In the video link below, watch Jim Orford, Domino’s K600i Product Manager, walk you through a demonstration of this newly developed digital cold foil and spot varnish application using Domino’s market leading UV ink jet K600i printers installed on an AB Graphic’s Digicon 3 finishing line.

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Abbey Labels doubles die-cutting speed with MPS and AB Graphics

Abbey Labels recently installed an automated MPS EFS 340 flexo press, equipped with an integrated AB Graphics Fast Track semi-rotary die cutting system. The innovation, a world first, is part of Abbey Labels’ ambitious operation optimization program.

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Actega Metal Print announces Kolbe-Coloco as first EcoLeaf™ beta customer

Actega Metal Print GmbH today announces the German print specialist, Kolbe-Coloco Spezialdruck GmbH, as the world’s first beta customer for its revolutionary, sustainable and cost-effective metallization technology, EcoLeaf™. Focusing on high-end applications, the company will use the new solution to print profit driving metallization embellishments onto self-adhesive labels for a broad variety of markets. The company cites the eradication of foil and its sustainability advantages as a key decision.

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Miraclon announces return of Global Flexo Innovation Awards

Miraclon, home of Kodak Flexcel Solutions, announces the return of the Global Flexo Innovation Awards to honor companies that are at the forefront of the transformation of the flexo industry. Christopher Horton, former senior vice president of SGS, will chair the independent international judging panel that will comprise a rich selection of flexo industry influencers, technical experts and CPGs.

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Syntegon Technology brings interpack booth to customers’ desks

Following the announcement by Messe Duesseldorf that interpack 2020, which was scheduled for May, will be postponed to next year, Syntegon Technology will present its latest processing and packaging technology on a virtual exhibition booth from 7 to 13 May 2020. The online presence will cover digital product presentations and individual contact opportunities with the experts from Syntegon Technology, who will inform both customers and media representatives about the company’s intelligent and sustainable solutions.

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+++ IMPORTANT +++
Corona Virus: interpack 2020 postponed

Messe Düsseldorf is postponing the leading international trade fair interpack. It will now take place from 25 February to 3 March 2021. In doing so, Messe Düsseldorf is following the recommendation of the crisis management team of the German Federal Government to take into account the principles of the Robert Koch Institute when assessing the risk of major events. Based on this recommendation and the recent significant increase in the number of people infected with the new corona virus (SARS-CoV-2), including in Europe, Messe Düsseldorf has reassessed the situation. In addition, there is the general ruling issued by the city of Düsseldorf on 11 March 2020, in which major events with more than 1,000 participants present at the same time are generally prohibited.

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Koenig & Bauer receives “Company to Watch” award

At the Fifth Annual Digital Packaging Summit, which was held in Ponte Vedra Beach/Florida in November 2019, Koenig & Bauer was honoured with the coveted “Company to Watch” award. The three-day event is organised and coordinated by NAPCO Media and the magazine Packaging Impressions, and played host to 95 executives from the printing and packaging industries who were keen to find out about the latest developments in digital technologies for use in packaging printing. During the event, the attendees were also asked to vote for the company which they considered the “Company to Watch”.

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Corex at Interpack

Corex and Blue Box Partners (BBP) will share a stand at Europe’s leading packaging show to underline the importance of sustainability and highlight their collaborative expertise to deliver a partnership for paper-based packaging solutions.

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Strategic advances at JM Heaford lead Muncaster to take on US sales role

JM Heaford, supplier of mounting and proofing solutions for the tag and label, flexible packaging, corrugated and gravure markets, has announced organisational changes to ensure consistency and ongoing progress as the company builds on strategic success. As part of the plan, David Muncaster adds sales in North America to his responsibilities.

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drupa

Koenig & Bauer heading for drupa with vigour

Koenig & Bauer is heading to the flagship trade fair of the print and media branch with a raft of digitalisation solutions, product innovations and a completely new machine design: “At drupa, we will be bringing the customer experience together with our latest innovations from the print industry,” promises president and CEO Claus Bolza-Schünemann. Because Koenig & Bauer brings together. That is the central message ahead of the branch’s leading trade fair in June. “The world of print is a fascinating world,” says Bolza-Schünemann. “It is the diversity of solutions for printing and finishing which makes it so colourful. And we invite visitors to the fair to explore this world.”

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