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Billerud launches ConFlex® HeatSeal
Billerud has developed a recyclable, heat-sealable paper designed to replace plastic in packaging applications with high demands for sealing performance and recyclability.
Windmöller & Hölscher at Chinaplas 2025: Hall 10 Booth G03
Chinaplas 2025, a technology-oriented plastics and rubber trade fair, takes place on April 15-18, 2025, in the Shenzhen World Exhibition & Convention Center (Bao'an). As a global technology company, W&H develops sustainable flexible packaging through innovative solutions in extrusion, printing and converting and will present these at Chinaplas 2025. The claim “get in the loop” emphasizes this commitment to the circular economy and resource conservation.
Emtec Electronic to exhibit with IDMtest at SPAPER 2025 in Zaragoza
The German company emtec Electronic GmbH will participating with its partner IDMtest as an exhibitor at SPAPER 2025, which is set to take place from March 4–6, 2025, at Feria de Zaragoza, Spain. The shown laboratory devices, used in the wet-end area and for base and final paper products, are said to focus on efficiency, precision, and sustainability, helping to optimize production processes.
